Dimensions: 1,200mm (w) x 300mm (d) x 2,200mm (h)
Application: Telecom Infrastructure and Data Centre - Splice and Patch, Cross Connect, Internal Distribution, Meet me Room (MMR), Internal and zone distribution cabling
The 313 series ODF is a leading edge solution, which can be configured to support a variety of applications, including ultra high density splice/patch of incoming line cable, or as a patching / distribution frame.
This flexible solution can be deployed in a telecom carrier exchange, or in a Data Centre environment (MMR, cross connect frame, zone distribution frame).
One of the main benefits of the WBT ODF single sided access solution, is its ability to be placed against walls, back to back, or at the end of aisles, requiring minimal floor space.
ODF solution density:
Part No. |
Description |
TC4050313DCE |
UHDODF 1200mm x 300mm x 2200mm (top&bottom internal duct ), 21” rails |
TC4050-170DCKITE |
Door and side panel kit to suit 313 series ODF |
TC4050-349KIT-GY10 |
Duct cover side panels for 313 series ODF |
TC4050TMKIT |
Underfloor mounting kit for HDODF |
105X49-L2.5 |
Black transport tubing, 6.5 OD, 4.5 ID L=2.5M |
WBT fibre optic infrastructure solutions have elevated cable management to the next level. These high-density solutions can be deployed separately or as an end-to-end solution in a Data Centre or Telecommunications network.
Application includes:
The end to end solution also provides scalability at RU level, with 96F and 144F LC or LC/A deployments.
Can be deployed as an end to end network solution in any Data Centre or Telecommunications network and is compatible with stranded or ultra high density rollable ribbon cable types (864F, 1728F, 3456F, 6912F).
Ultra high density Fibre Termination Panels (FTP’s) or other associated infrastructure can also be successfully deployed as standalone solutions.
LC-LC/A
per RU modules
(splice &/or patch)
in 300mm deep,
single side ODF*
deployment
LC-LC/A
per RU modules
(splice &/or patch)
in 300mm deep,
single side ODF*
deployment
MTP®/MPO
per RU modules
(splice &/or patch)
in 300mm deep,
single side ODF*
deployment
*ODFs can be placed back to back and capacities can be doubled in a 600mm deep footprint